MT49H16M18CBM-25 Micron Technology Inc, MT49H16M18CBM-25 Datasheet - Page 5

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MT49H16M18CBM-25

Manufacturer Part Number
MT49H16M18CBM-25
Description
Manufacturer
Micron Technology Inc
Type
RLDRAMr
Datasheet

Specifications of MT49H16M18CBM-25

Organization
16Mx18
Density
288Mb
Address Bus
23b
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
1.8V
Package Type
uBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
779mA
Pin Count
144
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT49H16M18CBM-25
Manufacturer:
MICRON
Quantity:
20 000
Part Number:
MT49H16M18CBM-25 IT:B
Manufacturer:
MICRON
Quantity:
20 000
Part Number:
MT49H16M18CBM-25:B
Manufacturer:
MICRON
Quantity:
20 000
List of Tables
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PDF: 09005aef80a41b59/Source: 09005aef811ba111
288Mb_RLDRAM_II_SIOLOT.fm - Rev. P 1/11 EN
64 Meg x 9 Ball Assignments (Top View) 144-Ball µBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
32 Meg x 18 Ball Assignments (Top View) 144-Ball µBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Ball Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
I
I
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
DC Electrical Characteristics and Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Input AC Logic Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Differential Input Clock Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Address and Command Setup and Hold Derating Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Data Setup and Hold Derating Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Capacitance – µBGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Temperature Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Thermal Impedance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Description of Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Command Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Address Widths at Different Burst Lengths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
On-Die Termination DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Address Mapping in Multiplexed Address Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Cycle Time and READ/WRITE Latency Configuration Table in Multiplexed Mode . . . . . . . . . . . . . .59
TAP Input AC Logic Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
TAP AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
TAP DC Electrical Characteristics and Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Identification Register Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Scan Register Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Instruction Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Boundary Scan (Exit) Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Cycle Time and READ/WRITE Latency Configuration Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
DD
DD
Operating Conditions and Maximum Limits—Rev. A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Operating Conditions and Maximum Limits—Rev. B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
288Mb: x18 2.5V V
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
EXT
, 1.8V V
DD
, HSTL, SIO, RLDRAM II
©2003Micron Technology, Inc. All rights reserved.
List of Tables

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