S9S08SG16E1CTJ Freescale, S9S08SG16E1CTJ Datasheet - Page 19

• Manufacturer Part Number: S9S08SG16E1CTJ
• Manufacturer: Freescale

Specifications of S9S08SG16E1CTJ

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: SCI/SPI
• Total Internal Ram Size: 1KB
• # I/os (max): 16
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 12-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: TSSOP
• Program Memory Type: Flash
• Program Memory Size: 16KB
• Lead Free Status / RoHS Status: Compliant

Section Number
17.3 On-Chip Debug System (DBG) .................................................................................................... 279
17.4 Register Definition ........................................................................................................................ 283
A.1 Introduction ....................................................................................................................................291
A.2 Parameter Classification.................................................................................................................291
A.3 Absolute Maximum Ratings...........................................................................................................291
A.4 Thermal Characteristics..................................................................................................................293
A.5 ESD Protection and Latch-Up Immunity .......................................................................................295
A.6 DC Characteristics..........................................................................................................................296
A.7 Supply Current Characteristics.......................................................................................................302
A.8 External Oscillator (XOSC) Characteristics ..................................................................................306
A.9 Internal Clock Source (ICS) Characteristics ..................................................................................308
A.10 Analog Comparator (ACMP) Electricals .......................................................................................309
A.11 ADC Characteristics.......................................................................................................................310
A.12 AC Characteristics..........................................................................................................................316
A.13 Flash Specifications........................................................................................................................323
A.14 EMC Performance..........................................................................................................................324
B.1 Ordering Information .....................................................................................................................325
B.2 Package Information and Mechanical Drawings ...........................................................................326
Freescale Semiconductor
17.3.1 Comparators A and B...................................................................................................... 279
17.3.2 Bus Capture Information and FIFO Operation ............................................................... 279
17.3.3 Change-of-Flow Information .......................................................................................... 280
17.3.4 Tag vs. Force Breakpoints and Triggers ......................................................................... 280
17.3.5 Trigger Modes................................................................................................................. 281
17.3.6 Hardware Breakpoints .................................................................................................... 283
17.4.1 BDC Registers and Control Bits ..................................................................................... 283
17.4.2 System Background Debug Force Reset Register (SBDFR) .......................................... 285
17.4.3 DBG Registers and Control Bits..................................................................................... 286
A.12.1 Control Timing ................................................................................................................316
A.12.2 TPM/MTIM Module Timing ...........................................................................................318
A.12.3 SPI....................................................................................................................................319
A.14.1 Radiated Emissions..........................................................................................................324
B.1.1 Device Numbering Scheme .............................................................................................326
Ordering Information and Mechanical Drawings
Electrical Characteristics
MC9S08SG32 Data Sheet, Rev. 8
Appendix A
Appendix B
Title
Page
19