MT41J256M8DA-125:H Micron Technology Inc, MT41J256M8DA-125:H Datasheet - Page 25

• Manufacturer Part Number: MT41J256M8DA-125:H
• Manufacturer: Micron Technology Inc

Specifications of MT41J256M8DA-125:H

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Package Dimensions
Figure 9: 78-Ball FBGA – x4, x8; "DA"
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
78X Ø0.45
Seating
0.12 A
Plane
9.6 CTR
0.8 TYP
A
Note:
9 8 7
1. All dimensions are in millimeters.
6.4 CTR
1.8 CTR
Nonconductive overmold
8 ±0.1
0.8 TYP
3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
10.5 ±0.1
0.8 ±0.05
25
Ball A1 ID
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR3 SDRAM
0.25 MIN
1.2 MAX
Package Dimensions
© 2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID