AT94S40AL-25DGC Atmel, AT94S40AL-25DGC Datasheet - Page 31

• Manufacturer Part Number: AT94S40AL-25DGC
• Description: IC FPSLIC 40K GATE 25MHZ 256BGA
• Manufacturer: Atmel
• Series: FPSLIC®r

Specifications of AT94S40AL-25DGC

• Core Type: 8-bit AVR
• Speed: 16MHz
• Interface: I²C, UART
• Program Sram Bytes: 20K-32K
• Fpga Sram: 18kb
• Eeprom Size: 1M x 8
• Data Sram Bytes: 4K ~ 16K
• Fpga Core Cells: 2304
• Fpga Gates: 40K
• Fpga Registers: 2862
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 256-CABGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

8.2
2314E–FPSLI–6/05
Notes:
A1
e
144L1 – LQFP
1. This drawing is for general information only; refer to JEDEC Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
R
body size dimensions including mold mismatch.
b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and
an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
2325 Orchard Parkway
San Jose, CA 95131
A2
b
L1
Side View
Top View
D1
TITLE
144L1, 144-lead (20 x 20 x 1.4 mm Body), Low Profile
Plastic Quad Flat Pack (LQFP)
E1
SYMBOL
XX
A1
A2
D
D1
E
E1
e
b
L1
AT94S Secure Family
Bottom View
0.05
1.35
0.17
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
D
22.00 BSC
20.00 BSC
22.00 BSC
20.00 BSC
0.50 BSC
1.00 REF
NOM
1.40
0.22
DRAWING NO.
N
144L1
MAX
0.15
1.45
0.27
NOTE
2, 3
2, 3
11/30/01
6
4, 5
E
REV.
A
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