M29F400FB55M3F2 Micron Technology Inc, M29F400FB55M3F2 Datasheet - Page 47

• Manufacturer Part Number: M29F400FB55M3F2
• Manufacturer: Micron Technology Inc

Specifications of M29F400FB55M3F2

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 55ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 19/18Bit
• Operating Supply Voltage (typ): 5V
• Operating Temp Range: -40C to 125C
• Package Type: SO W
• Program/erase Volt (typ): 4.5 to 5.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Automotive
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Word Size: 8/16Bit
• Number Of Words: 512K/256K
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 44
• Lead Free Status / Rohs Status: Compliant

Figure 26. TFBGA48 6 x 8 mm - 6 x 8 ball array, 0.80 mm pitch, package outline
Table 21.
Symbol
ddd
FD
SD
SE
A1
A2
D1
E1
FE
D
A
b
E
e
data
TFBGA48 6 x 8 mm - 6 x 8 ball array, 0.80 mm pitch, package mechanical
E
6.000
4.000
8.000
5.600
0.800
1.000
1.200
0.400
0.400
Typ
E1
FE
BALL "A1"
FD
A
millimeters
0.260
0.350
5.900
7.900
e
Min
–
–
–
–
–
–
–
SD
D1
D
1.200
0.900
0.450
6.100
0.100
8.100
Max
–
–
–
–
–
–
–
b
SE
e
A1
0.2362
0.1575
0.3150
0.2205
0.0315
0.0394
0.0472
0.0157
0.0157
A2
Typ
inches
0.0102
0.0138
0.2323
0.3110
Min
–
–
–
–
–
–
–
BGA-Z32
ddd
0.0472
0.0354
0.0177
0.2402
0.0039
0.3189
Max
–
–
–
–
–
–
–
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