M29F400FB55M3F2 Micron Technology Inc, M29F400FB55M3F2 Datasheet - Page 48

• Manufacturer Part Number: M29F400FB55M3F2
• Manufacturer: Micron Technology Inc

Specifications of M29F400FB55M3F2

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 55ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 19/18Bit
• Operating Supply Voltage (typ): 5V
• Operating Temp Range: -40C to 125C
• Package Type: SO W
• Program/erase Volt (typ): 4.5 to 5.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Automotive
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Word Size: 8/16Bit
• Number Of Words: 512K/256K
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 44
• Lead Free Status / Rohs Status: Compliant

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Part Numbering
Table 22.
1. THis package is available only in the 8-Mbit, bottom boot configuration.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc.) or for further information on any aspect
of this device, please contact the Numonyx Sales Office nearest to you.
Example:
Device type
M29F = 5 V
Density
200 = 2-Mbit
400 = 4-Mbit
800 = 8-Mbit
160 = 16-Mbit (not available in SO44 package)
Technology
F = 110 nm
Configuration
T = Top Boot
B = Bottom Boot
Speed
55 = 55 ns device speed in conjunction with
temperature range = 3 denotes Auto Grade –40 to
125 °C parts
5A = 55 ns Access time (Auto Grade) only in
conjunction with the Grade 6 option
Package
M = SO 44.525 INCH CU
N = TSOP-1 48 12 x 20 AL 4
ZA
Temperature range
6 = –40 to 85 °C
3 = –40 to 125 °C
Packing option
<blank> = standard packing (Tray)
T = Tape & Reel 24 mm packing
E = RoHS package, standard packing (Tray)
F = RoHS package, Tape & Reel 24 mm packing
Fab location
2 = Numonyx Fab.2 (Singapore)
(1)
= TFBGA48, 6 x 8 mm, 0.80 mm pitch
Information scheme
M29F200F T
5A
M
6
-
2