TDA1566TH/N1C,118 NXP Semiconductors, TDA1566TH/N1C,118 Datasheet - Page 40

• Manufacturer Part Number: TDA1566TH/N1C,118
• Description: IC AMP AUDIO PWR 150W AB 24HSOP
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA1566TH/N1C,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 24-HSOP
• Max Output Power X Channels @ Load: 150W x 1 @ 1 Ohm; 75W x 2 @ 2 Ohm
• Voltage - Supply: 6.5 V ~ 18 V
• Features: Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 92 W
• Available Set Gain: 26 dB
• Common Mode Rejection Ratio (min): 60 dB
• Thd Plus Noise: 0.2 %
• Operating Supply Voltage: 14.4 V
• Maximum Power Dissipation: 80000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Speaker
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 80W
• Rail/rail I/o Type: No
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 24
• Package Type: HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935284624118; TDA1566TH/N1C-T; TDA1566TH/N1C-T

NXP Semiconductors
12. Handling information
13. Soldering
TDA1566_2
Product data sheet
13.2.1 Soldering by dipping or by solder wave
13.2.2 Manual soldering
13.3.1 Reflow soldering
13.1 Introduction
13.2 Through-hole mount packages
13.3 Surface mount packages
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C
or 265 C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Key characteristics in reflow soldering are:
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
Rev. 02 — 20 August 2007
I
2
C-bus controlled dual channel/single channel amplifier
Figure
28) than a PbSn process, thus
stg(max)
TDA1566
© NXP B.V. 2007. All rights reserved.
). If the
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