TDA1566TH/N1C,118 NXP Semiconductors, TDA1566TH/N1C,118 Datasheet - Page 43

• Manufacturer Part Number: TDA1566TH/N1C,118
• Description: IC AMP AUDIO PWR 150W AB 24HSOP
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA1566TH/N1C,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 24-HSOP
• Max Output Power X Channels @ Load: 150W x 1 @ 1 Ohm; 75W x 2 @ 2 Ohm
• Voltage - Supply: 6.5 V ~ 18 V
• Features: Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 92 W
• Available Set Gain: 26 dB
• Common Mode Rejection Ratio (min): 60 dB
• Thd Plus Noise: 0.2 %
• Operating Supply Voltage: 14.4 V
• Maximum Power Dissipation: 80000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Speaker
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 80W
• Rail/rail I/o Type: No
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 24
• Package Type: HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935284624118; TDA1566TH/N1C-T; TDA1566TH/N1C-T

NXP Semiconductors
Table 26.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil.
TDA1566_2
Product data sheet
Mounting
Surface mount
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your NXP
Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with
respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of
the moisture in them (the so called popcorn effect).
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
Hot bar soldering or manual soldering is suitable for PMFP packages.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed
through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C
measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate
between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the
heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint
must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely
not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate
soldering profile can be provided on request.
Suitability of IC packages for wave, reflow and dipping soldering methods
Package
BGA, HTSSON..T
LFBGA, SQFP, SSOP..T
VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP,
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[7]
, SO, SOJ
[1]
[10]
, WQCCN..L
[5]
, LBGA,
[5]
Rev. 02 — 20 August 2007
, TFBGA,
[10]
I
2
C-bus controlled dual channel/single channel amplifier
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
[6]
[7][8]
[9]
…continued
Reflow
suitable
suitable
suitable
suitable
suitable
not suitable
[2]
TDA1566
© NXP B.V. 2007. All rights reserved.
Dipping
10 C
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