TDA1566TH/N1C,118 NXP Semiconductors, TDA1566TH/N1C,118 Datasheet - Page 41

• Manufacturer Part Number: TDA1566TH/N1C,118
• Description: IC AMP AUDIO PWR 150W AB 24HSOP
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA1566TH/N1C,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 24-HSOP
• Max Output Power X Channels @ Load: 150W x 1 @ 1 Ohm; 75W x 2 @ 2 Ohm
• Voltage - Supply: 6.5 V ~ 18 V
• Features: Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 92 W
• Available Set Gain: 26 dB
• Common Mode Rejection Ratio (min): 60 dB
• Thd Plus Noise: 0.2 %
• Operating Supply Voltage: 14.4 V
• Maximum Power Dissipation: 80000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Speaker
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 80W
• Rail/rail I/o Type: No
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 24
• Package Type: HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935284624118; TDA1566TH/N1C-T; TDA1566TH/N1C-T

NXP Semiconductors
TDA1566_2
Product data sheet
Table 24.
Table 25.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 28. Temperature profiles for large and small components
2.5
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 24
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
25
28.
Rev. 02 — 20 August 2007
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
I
minimum peak temperature
2
= MSL limit, damage level
C-bus controlled dual channel/single channel amplifier
3
3
)
)
350 to 2000
260
250
245
220
220
350
temperature
peak
> 2000
260
245
245
TDA1566
© NXP B.V. 2007. All rights reserved.
001aac844
time
41 of 46