TDA1566TH/N1C,118 NXP Semiconductors, TDA1566TH/N1C,118 Datasheet - Page 42

• Manufacturer Part Number: TDA1566TH/N1C,118
• Description: IC AMP AUDIO PWR 150W AB 24HSOP
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA1566TH/N1C,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 24-HSOP
• Max Output Power X Channels @ Load: 150W x 1 @ 1 Ohm; 75W x 2 @ 2 Ohm
• Voltage - Supply: 6.5 V ~ 18 V
• Features: Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 92 W
• Available Set Gain: 26 dB
• Common Mode Rejection Ratio (min): 60 dB
• Thd Plus Noise: 0.2 %
• Operating Supply Voltage: 14.4 V
• Maximum Power Dissipation: 80000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Speaker
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 80W
• Rail/rail I/o Type: No
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 24
• Package Type: HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935284624118; TDA1566TH/N1C-T; TDA1566TH/N1C-T

NXP Semiconductors
Table 26.
TDA1566_2
Product data sheet
Mounting
Through-hole mount
Through-hole-surface
mount
Suitability of IC packages for wave, reflow and dipping soldering methods
13.3.2 Wave soldering
13.3.3 Manual soldering
13.4 Package related soldering information
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C
or 265 C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 C and 320 C.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
•
•
•
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
[4]
parallel to the transport direction of the printed-circuit board;
transport direction of the printed-circuit board.
[1]
Rev. 02 — 20 August 2007
I
2
C-bus controlled dual channel/single channel amplifier
Soldering method
Wave
suitable
suitable
not suitable
[3]
Reflow
not suitable
[2]
TDA1566
© NXP B.V. 2007. All rights reserved.
Dipping
suitable
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