STM32F417IE STMicroelectronics, STM32F417IE Datasheet - Page 97

• Manufacturer Part Number: STM32F417IE
• Description: High-performance and DSP with FPU, ARM Cortex-M4 MCU with 512 Kbytes Flash, 168 MHz CPU, Art Accelerator, Ethernet, HW crypto
• Manufacturer: STMicroelectronics

Specifications of STM32F417IE

• Core: ARM 32-bit Cortex™-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• 3×12-bit, 2.4 Msps A/d Converters: up to 24 channels and 7.2 MSPS in triple interleaved mode
• General-purpose Dma: 16-stream DMA controller with FIFOs and burst support
• Up To 17 Timers: up to twelve 16-bit and two 32-bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
• 10/100 Ethernet Mac With Dedicated Dma: supports IEEE 1588v2 hardware, MII/RMII
• Cryptographic Acceleration: hardware acceleration for AES 128, 192, 256, Triple DES, HASH (MD5, SHA-1), and HMAC
• Rtc: subsecond accuracy, hardware calendar

STM32F415xx, STM32F417xx
A device reset allows normal operations to be resumed.
The test results are given in
defined in application note AN1709.
Table 39.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
●
●
●
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
V
V
Symbol
FESD
EFTB
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
pins to induce a functional disturbance
EMS characteristics
Parameter
Table
Doc ID 022063 Rev 2
39. They are based on the EMS levels and classes
DD
and V
SS
V
f
IEC 61000-4-2
V
f
IEC 61000-4-2
HCLK
HCLK
DD
DD
= 3.3 V, LQFP176, T
= 3.3 V, LQFP176, T
= 168 MHz, conforms to
= 168 MHz, conforms to
Conditions
Electrical characteristics
A
A
= +25 °C,
= +25 °C,
Level/
Class
97/168
2B
4A