MD4331-d1G-MECH M-Systems Inc., MD4331-d1G-MECH Datasheet - Page 28

• Manufacturer Part Number: MD4331-d1G-MECH
• Description: Mobile Diskonchip G3 Data Sheet
• Manufacturer: M-Systems Inc.

2.5
2.5.1 Ball Diagram
See Figure 9 for the Mobile DiskOnChip G3 1Gb (dual-die) ball diagram. To ensure proper device
functionality, balls marked RSRVD are reserved for future use and should not be connected.
Note: Mobile DiskOnChip G3 1Gb is designed as a drop-in replacement for Mobile DiskOnChip
9x12 FBGA Package
25
G3 512Mb, assuming that the board was designed according to the migration guide
guidelines. Refer to application note AP-DOC-067, Preparing your PCB Footprint for the
DiskOnChip BGA Migration Path, for further information.
1Gb Multiplexed Interface
Figure 9: Ballout for Multiplexed Interface (Mobile DiskOnChip G3 1Gb 9x12 FBGA Package)
M
A
B
C
D
G
H
K
E
F
J
L
1
M
M
M
M
M
M
A
RSRVD
VSS
VSS
VSS
DPD
CE#
2
VSS
VSS
VSS
VSS
VSS
OE#
AD0
AD8
3
RSRVD
RSRVD
RSRVD
VCCQ
AD10
AD1
AD9
AD2
4
Data Sheet, Rev. 1.0
RSRVD
RSTIN#
BUSY#
AD11
VCC
AD3
5
RSRVD
RSRVD
VCCQ
WE#
AD4
CLK
6
RSRVD
AD13
AD12
VSS
VSS
VSS
AD6
AD5
7
DMARQ#
ID0(VSS)
LOCK#
AD15
AD14
VSS
VSS
AD7
8
RSRVD
RSRVD
RSRVD
AVD#
IRQ#
VSS
9
Mobile DiskOnChip G3
10
M
M
M
M
M
M
91-SR-011-05-8L