mt47h64m8b6-5e-it Micron Semiconductor Products, mt47h64m8b6-5e-it Datasheet - Page 23
mt47h64m8b6-5e-it
Manufacturer Part Number
mt47h64m8b6-5e-it
Description
512mb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT47H64M8B6-5E-IT.pdf
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Table 6:
Figure 14:
PDF: 09005aef82f1e6e2/Source: 09005aef821aed36
512Mb_DDR2_x4x8x16_D2.fm - 512Mb DDR2: Rev. L; Core DDR2: Rev. C 4/08 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Temperature Limits
Example Temperature Test Point Location
Notes:
1. MAX storage case temperature; T
2. MAX operating case temperature; T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
Test point
Figure 14. This case temperature limit is allowed to be exceeded briefly during package
reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering Parameters.”
Figure 14.
Lmm x Wmm FGBA
Width (W)
Symbol
0.5 (W)
T
23
T
T
T
T
T
STG
A
A
C
C
C
Electrical Specifications – Absolute Ratings
STG
C
is measured in the center of the package, as shown in
is measured in the center of the package, as shown in
0.5 (L)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Min
–55
–40
–40
–40
–40
0
Length (L)
512Mb: x4, x8, x16 DDR2 SDRAM
Max
+150
+105
+105
+85
+95
+85
©2004 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
C
during operation.
Notes
2, 3, 4
2, 3, 4
2, 3
4, 5
4, 5
1
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