LPC1752 PHILIPS [NXP Semiconductors], LPC1752 Datasheet - Page 38

• Manufacturer Part Number: LPC1752
• Description: 32-bit ARM Cortex-M3 MCU up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC1758_56_54_52_51_2
Objective data sheet
Symbol
R
T
DD
j(max)
th(j-a)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
maximum junction
temperature
9.1 Thermal characteristics
amb
T
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
J
= 40 C to +85 C unless otherwise specified;
•
•
•
=
T
R
P
amb
D
T
th(j-a)
amb
= sum of internal and I/O power dissipation
= ambient temperature ( C),
= the package junction-to-ambient thermal resistance ( C/W)
+
P
D
Conditions
LQFP80 package
R
th j a
Rev. 02 — 11 February 2009
–
J
( C), can be calculated using the following
LPC1758/56/54/52/51
Min
-
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
<tbd>
-
. The I/O power dissipation of
Max
-
150
© NXP B.V. 2009. All rights reserved.
Unit
38 of 71
C/W
C
(1)