S71GL064A08 SPANSION [SPANSION], S71GL064A08 Datasheet - Page 102

• Manufacturer Part Number: S71GL064A08
• Description: STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
• Manufacturer: SPANSION [SPANSION]

100
A2 A1
A2
A2
1
0
0
0
0
0
0
x
1
1
0
0
PASR Mode Standby Current
Deep Sleep Current
Temperature Compensated Refresh Current
A1
A1
0
1
1
0
0
1
1
0
1
1
1
1
ICC Characteristics
Item
A0
A0
A0
0
1
0
1
0
1
0
0
1
0
1
0
Item
One-quarter of die
One-half of die
Full die
One-quarter of die
One-half of die
One-quarter of die
One-half of die
Bottom quarter of die
Table 25. Address Patterns for PASR (A4=1) (64M) (Continued)
Item
Bottom half of die
Active Section
Table 28. Address Patterns for RMS (A3 = 1, A4 = 1) (32M)
Active Section
Active Section
Table 27. Address Patterns for PAR (A3= 0, A4=1) (32M)
Symbol
Full array
Reserved
No PASR
I
ZZ
Symbol
Table 26. Deep ICC Characteristics (for 64Mb)
I
PASR
V
IN
V
A d v a n c e
= V
IN
S71GL064A based MCPs
= V
CC
or 0V, Chip Disabled, t
CC
Symbol
000000h - 07FFFFh
000000h - 0FFFFFh
000000h - 1FFFFFh
180000h - 1FFFFFh
100000h - 1FFFFFh
I
000000h - 07FFFFh
000000h - 0FFFFFh
or 0V, Chip in ZZ# mode, t
TCR
Test
000000h-0FFFFFh
000000h-1FFFFFh
000000h-3FFFFFh
I n f o r m a t i o n
Address Space
Max Temperature
Test
Address Space
Address Space
None
15°C
45°C
70°C
85°C
A
= 85°C
A
= 25°C
Array Partition Typ
Typ
1/4 Array
1/2 Array
Full Array
None
S71GL064A_00_A2 February 8, 2005
Max
120
512Kb x 16
512Kb x 16
512Kb x 16
50
60
80
1Mb x 16
2Mb x 16
4Mb x 16
1Mb x 16
1Mb x 16
2Mb x 16
1Mb x 16
Typ
Size
Size
Size
0
Max
10
Max
120
10
60
80
Unit
µA
Density
Density
Density
16Mb
32Mb
64Mb
16Mb
32Mb
16Mb
16Mb
8Mb
8Mb
8Mb
Unit
0
Unit
µA
µA