GS880E32T-100 GSI [GSI Technology], GS880E32T-100 Datasheet
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GS880E32T-100
Related parts for GS880E32T-100
GS880E32T-100 Summary of contents
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... DD Functional Description Applications The GS880E18/32/36T is a 9,437,184-bit (8,388,608-bit for x32 version) high performance synchronous SRAM with a 2- bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support ...
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GS880E18 100-Pin TQFP Pinout 100 DDQ ...
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GS880E32 100-Pin TQFP Pinout 100 DDQ ...
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GS880E36 100-Pin TQFP Pinout 100 DDQ ...
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TQFP Pin Description Pin Location 37, 36 35, 34, 33, 32, 100, 99, 82, 81, 44, 45, 46, 47, 48, 49, 50 63, 62, 59, 58, 57, 56, 53, 52 68, 69, 72, 73, 74, 75, 78, 79 ...
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GS880E32 Block Diagram Register A0– LBO ADV CK ADSC ADSP Power Down ZZ Control Note: Only x36 version ...
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Mode Pin Functions Mode Name Burst Order Control Output Register Control Power Down Control Note: There are pull-up devices on the LBO and FT pins and a pull down device on the ZZ pin, so those input pins can be ...
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Synchronous Truth Table Address Operation Used Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Read Cycle, Begin Burst External Read Cycle, Begin Burst External Write Cycle, Begin Burst External Read Cycle, Continue Burst Read Cycle, Continue ...
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Simplified State Diagram Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1, E2, and E3) and ...
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Simplified State Diagram with G Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use Use of “Dummy Reads” (Read Cycles with G High) may be used to make ...
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Absolute Maximum Ratings (All voltages reference Symbol Description V Voltage Voltage in V DDQ DDQ V Voltage on Clock Input Pin CK V Voltage on I/O Pins I/O V Voltage on Other ...
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... Junction to Ambient (at 200 lfm) Junction to Ambient (at 200 lfm) Junction to Case (TOP) Notes: 1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper- ature air flow, board density, and PCB thermal resistance. 2. SCMI G-38-87 3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1 Rev: 1 ...
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AC Test Conditions Parameter Input high level Input low level Input slew rate Input reference level Output reference level Output load Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. ...
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Operating Currents Parameter Test Conditions Symbol Device Selected; Operating Pipeline All other inputs Current Output open Flow-Thru Standby Pipeline 0.2V DD Current Flow-Thru Device Deselected; Deselect Pipeline All other inputs Current V ...
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AC Electrical Characteristics Parameter Clock Cycle Time Clock to Output Valid Pipeline Clock to Output Invalid Clock to Output in Low-Z Clock Cycle Time Clock to Output Valid Flow- Thru Clock to Output Invalid Clock to Output in Low-Z Clock ...
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Write Cycle Timing Single Write ADSP tS tH ADSC tS tH ADV ADV must be inactive for ADSP Write – WR1 –B WR1 ...
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Flow Through Read-Write Cycle Timing Single Read ADSP ADSC ADV – RD1 – tOE G ...
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Flow Through Read Cycle Timing Single Read ADSP ADSC ADV –A RD1 – tOLZ ...
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Pipelined DCD Read Cycle Timing Single Read ADSP ADSC ADV –A RD1 – Hi-Z ...
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Pipelined DCD Read-Write Cycle Timing Single Read ADSP ADSC tS tH ADV – RD1 – ...
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... Dummy read cycles waste performance but their use usually assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at bank address boundary crossings) but greater care must be exercised to avoid excessive bus contention ...
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Output Driver Characteristics 120.0 100.0 Pull Down Drivers 80.0 60.0 40.0 20.0 0.0 -20.0 -40.0 -60.0 Pull Up Drivers -80.0 -100.0 -120.0 -140.0 -0 Rev: 1.11 11/2000 Specifications cited are subject to change without notice. For ...
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TQFP Package Drawing Symbol Description Min. Nom. Max A1 Standoff 0.05 A2 Body Thickness 1.35 b Lead Width 0.20 c Lead Thickness 0.09 D Terminal Dimension 21.9 D1 Package Body 19.9 E Terminal Dimension 15.9 E1 Package Body 13.9 e ...
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... GS880E18T-11.5I 514K x 18 GS880E18T-100I 514K x 18 GS880E18T-80I 514K x 18 GS880E18T-66I 256K x 32 GS880E32T-11I 256K x 32 GS880E32T-11.5I 256K x 32 GS880E32T-100I 256K x 32 GS880E32T-80I 256K x 32 GS880E32T-66I 256K x 36 GS880E36T-11I 256K x 36 GS880E36T-11.5I 256K x 36 GS880E36T-100I 256K x 36 GS880E36T-80I 256K x 36 ...
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Revision History Types of Changes DS/DateRev. Code: Old; Format or Content New GS880E18/32/36TRev1.04h 5/1999; 1.05 9/1999I GS880E18/32/36T1.05 11/ 1999K880E18/32/36T1.06 1/ 2000L GS880E18/32/36T1.06 1/ 2000L; GS880E18/32/36T1.07 3/ 2000N; GS880E18/32/36T1.07 3/ 2000N; GS880E18/32/36T1.08 3/ 2000O; GS880E18/32/36T1.08 3/ 2000O; 880E183236_r1_09 880E18_r1_09; 880E18_r1_10 880E18_r1_10; ...