LPC1778FBD144,551 NXP Semiconductors, LPC1778FBD144,551 Datasheet - Page 112

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LPC1778FBD144,551

Manufacturer Part Number
LPC1778FBD144,551
Description
ARM Microcontrollers - MCU CORTEX-M3 512KB FL 96KB SRAM USB 2.0
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1778FBD144,551

Rohs
yes
Core
ARM Cortex M3
Processor Series
LPC178x
Data Bus Width
32 bit
Maximum Clock Frequency
120 MHz
Program Memory Size
512 KB
Data Ram Size
64 KB
On-chip Adc
Yes
Operating Supply Voltage
2.4 V to 3.6 V
Package / Case
LQFP-144
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
8
Interface Type
CAN, I2C, I2S, SSP
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
165
Number Of Timers
4
On-chip Dac
Yes
Program Memory Type
Flash
Factory Pack Quantity
60
Supply Voltage - Max
3.6 V
Supply Voltage - Min
2.4 V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1778FBD144,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC178X_7X
Product data sheet
Fig 46. Reflow soldering of the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 4.1 — 15 November 2012
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC178x/7x
© NXP B.V. 2012. All rights reserved.
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SOT570-2
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