LPC1778FBD144,551 NXP Semiconductors, LPC1778FBD144,551 Datasheet - Page 5

• Manufacturer Part Number: LPC1778FBD144,551
• Description: ARM Microcontrollers - MCU CORTEX-M3 512KB FL 96KB SRAM USB 2.0
• Manufacturer: NXP Semiconductors

Specifications of LPC1778FBD144,551

• Rohs: yes
• Core: ARM Cortex M3
• Processor Series: LPC178x
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 120 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 64 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2.4 V to 3.6 V
• Package / Case: LQFP-144
• Mounting Style: SMD/SMT
• A/d Bit Size: 12 bit
• A/d Channels Available: 8
• Interface Type: CAN, I2C, I2S, SSP
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 165
• Number Of Timers: 4
• On-chip Dac: Yes
• Program Memory Type: Flash
• Factory Pack Quantity: 60
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.4 V

NXP Semiconductors
4. Ordering information
Table 1.
LPC178X_7X
Product data sheet
Type number
LPC1788
LPC1788FBD208
LPC1788FET208
LPC1788FET180
LPC1788FBD144
LPC1787
LPC1787FBD208
LPC1786
LPC1786FBD208
LPC1785
LPC1785FBD208
LPC1778
LPC1778FBD208
LPC1778FET208
LPC1778FET180
LPC1778FBD144
LPC1777
LPC1777FBD208
LPC1776
LPC1776FBD208
LPC1776FET180
LPC1774
LPC1774FBD208
LPC1774FBD144
Ordering information
Package
Name
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
LQFP208
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
TFBGA180
LQFP208
LQFP144
plastic thin fine-pitch ball grid array package; 208 balls; body
Description
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
15  15  0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12  12 0.8 mm
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic thin fine-pitch ball grid array package; 208 balls; body
15  15  0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12  12 0.8 mm
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
thin fine-pitch ball grid array package; 180 balls; body 12  12 0.8 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
All information provided in this document is subject to legal disclaimers.
Rev. 4.1 — 15 November 2012
32-bit ARM Cortex-M3 microcontroller
LPC178x/7x
© NXP B.V. 2012. All rights reserved.
Version
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT459-1
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT570-2
SOT459-1
SOT486-1
5 of 120