LPC1778FBD144,551 NXP Semiconductors, LPC1778FBD144,551 Datasheet - Page 70

• Manufacturer Part Number: LPC1778FBD144,551
• Description: ARM Microcontrollers - MCU CORTEX-M3 512KB FL 96KB SRAM USB 2.0
• Manufacturer: NXP Semiconductors

Specifications of LPC1778FBD144,551

• Rohs: yes
• Core: ARM Cortex M3
• Processor Series: LPC178x
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 120 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 64 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2.4 V to 3.6 V
• Package / Case: LQFP-144
• Mounting Style: SMD/SMT
• A/d Bit Size: 12 bit
• A/d Channels Available: 8
• Interface Type: CAN, I2C, I2S, SSP
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 165
• Number Of Timers: 4
• On-chip Dac: Yes
• Program Memory Type: Flash
• Factory Pack Quantity: 60
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.4 V

NXP Semiconductors
9. Thermal characteristics
Table 10.
V
LPC178X_7X
Product data sheet
Symbol
T
DD
j(max)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
Table 11.
T
T
ja
jc
jb
amb
= 40 C to +85 C unless otherwise specified;
•
•
•
j
=
T
R
P
=
amb
D
T
th(j-a)

amb
= sum of internal and I/O power dissipation
40
= ambient temperature (C),

+
= the package junction-to-ambient thermal resistance (C/W)
Thermal resistance (LQFP packages)
C to +85

P
D
All information provided in this document is subject to legal disclaimers.
JEDEC (4.5 in  4 in)
Single-layer (4.5 in  3 in)
Conditions

0 m/s
1 m/s
2.5 m/s
0 m/s
1 m/s
2.5 m/s
R

th j a
C unless otherwise specified.
Rev. 4.1 — 15 November 2012

–


j
(C), can be calculated using the following
Thermal resistance in C/W ±15 %
LQFP208
27.4
25.7
24.4
35.4
31.2
29.2
8.8
15.4
Min
-
32-bit ARM Cortex-M3 microcontroller
Typ
-
LPC178x/7x
LQFP144
31.5
28.1
26.2
43.2
35.7
32.8
7.8
13.8
Max
125
© NXP B.V. 2012. All rights reserved.
Unit
70 of 120
C
(1)