KIT35XS3400EVBE Freescale Semiconductor, KIT35XS3400EVBE Datasheet - Page 45

• Manufacturer Part Number: KIT35XS3400EVBE
• Description: KIT EVALUATION FOR MC35XS3400
• Manufacturer: Freescale Semiconductor

Specifications of KIT35XS3400EVBE

• Main Purpose: Automotive Lighting
• Utilized Ic / Part: *
• Primary Attributes: 4 protected high-side switches
• Secondary Attributes: SPI Interface
• Silicon Manufacturer: Freescale
• Silicon Core Number: MC35XS3400
• Kit Application Type: Power Management
• Application Sub Type: EXtreme Switch
• Kit Contents: Evaluation Board, CD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Embedded: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
Material:
Outline:
Area A:
Ambient Conditions:
Figure 18. Steady State Thermal Resistance in Dependence on Heat Spreading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness
0.035 mm
76.2 mm x 114.3 mm board area,
including edge connector for thermal
testing, 74 mm x 74 mm buried
layers area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 26. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θ
JA mn
θJA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
1 = Power Chip, 2 = Logic Chip
m = 1,
47.63
42.82
41.23
40.07
39.24
500
n = 1
THERMAL ADDENDUM (REV 1.0)
ADDITIONAL DOCUMENTATION
m = 1, n = 2
m = 2, n = 1
600
37.21
33.14
31.84
30.90
30.14
35XS3400
m = 2,
53.61
51.06
50.36
49.26
48.57
n = 2
(°C/W)
45