MCU AVR 32K FLASH 32TQFP

ATMEGA328P-AU

Manufacturer Part NumberATMEGA328P-AU
DescriptionMCU AVR 32K FLASH 32TQFP
ManufacturerAtmel
SeriesAVR® ATmega
ATMEGA328P-AU datasheets
 


Specifications of ATMEGA328P-AU

Core ProcessorAVRCore Size8-Bit
Speed20MHzConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTNumber Of I /o23
Program Memory Size32KB (16K x 16)Program Memory TypeFLASH
Eeprom Size1K x 8Ram Size2K x 8
Voltage - Supply (vcc/vdd)1.8 V ~ 5.5 VData ConvertersA/D 8x10b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Package / Case32-TQFP, 32-VQFPProcessor SeriesATMEGA32x
CoreAVR8Data Bus Width8 bit
Data Ram Size2 KBInterface Type2-Wire, SPI, USART
Maximum Clock Frequency20 MHzNumber Of Programmable I/os23
Number Of Timers3Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWAVR, EWAVR-BL
Development Tools By SupplierATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKITMinimum Operating Temperature- 40 C
On-chip Adc10 bit, 8 ChannelCpu FamilyATmega
Device CoreAVRDevice Core Size8b
Frequency (max)20MHzTotal Internal Ram Size2KB
# I/os (max)23Number Of Timers - General Purpose3
Operating Supply Voltage (typ)2.5/3.3/5VOperating Supply Voltage (max)5.5V
Operating Supply Voltage (min)1.8VInstruction Set ArchitectureRISC
Operating Temp Range-40C to 85COperating Temperature ClassificationIndustrial
MountingSurface MountPin Count32
Package TypeTQFPController Family/seriesAVR MEGA
No. Of I/o's23Eeprom Memory Size1KB
Ram Memory Size2KBCpu Speed20MHz
Rohs CompliantYesFor Use WithATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVR
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther namesATMEGA328P-20AU
ATMEGA328P-20AU
Q3790246
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ATmega48A/48PA/88A/88PA/168A/168PA/328/328
27.7.3
Chip Erase
The Chip Erase will erase the Flash and EEPROM
not reset until the program memory has been completely erased. The Fuse bits are not
changed. A Chip Erase must be performed before the Flash and/or EEPROM are
reprogrammed.
Note:
Load Command “Chip Erase”
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “1000 0000”. This is the command for Chip Erase.
4. Give XTAL1 a positive pulse. This loads the command.
5. Give WR a negative pulse. This starts the Chip Erase. RDY/BSY goes low.
6. Wait until RDY/BSY goes high before loading a new command.
27.7.4
Programming the Flash
The Flash is organized in pages, see
the program data is latched into a page buffer. This allows one page of program data to be pro-
grammed simultaneously. The following procedure describes how to program the entire Flash
memory:
A. Load Command “Write Flash”
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “0001 0000”. This is the command for Write Flash.
4. Give XTAL1 a positive pulse. This loads the command.
B. Load Address Low byte
1. Set XA1, XA0 to “00”. This enables address loading.
2. Set BS1 to “0”. This selects low address.
3. Set DATA = Address low byte (0x00 - 0xFF).
4. Give XTAL1 a positive pulse. This loads the address low byte.
C. Load Data Low Byte
1. Set XA1, XA0 to “01”. This enables data loading.
2. Set DATA = Data low byte (0x00 - 0xFF).
3. Give XTAL1 a positive pulse. This loads the data byte.
D. Load Data High Byte
1. Set BS1 to “1”. This selects high data byte.
2. Set XA1, XA0 to “01”. This enables data loading.
3. Set DATA = Data high byte (0x00 - 0xFF).
4. Give XTAL1 a positive pulse. This loads the data byte.
E. Latch Data
1. Set BS1 to “1”. This selects high data byte.
2. Give PAGEL a positive pulse. This latches the data bytes. (See
waveforms)
F. Repeat B through E until the entire buffer is filled or until all data within the page is loaded.
8271C–AVR–08/10
1. The EEPRPOM memory is preserved during Chip Erase if the EESAVE Fuse is programmed.
Table 27-11 on page
(1)
memories plus Lock bits. The Lock bits are
301. When programming the Flash,
Figure 27-3
for signal
305