MC9S12NE64VTU Freescale Semiconductor, MC9S12NE64VTU Datasheet - Page 504

• Manufacturer Part Number: MC9S12NE64VTU
• Description: IC MCU 25MHZ ETHERNET/PHY 80TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTU

• Mfg Application Notes: MC9S12NE64 Integrated Ethernet Controller Implementing an Ethernet Interface with the MC9S12NE64 Web Server Development with MC9S12NE64 and Open TCP
• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 16 bit
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Appendix A Electrical Characteristics
A.6
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive
grade integrated circuits. During the device qualification ESD stresses were performed for the
human body model (HBM), the machine model (MM), and the charge device model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the
device specification. Complete DC parametric and functional testing is performed per the
applicable device specification at room temperature followed by hot temperature, unless specified
otherwise in the device specification.
504
1
2
3
4
5
Num
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when the device is powered from an external source.
All digital I/O pins are internally clamped to V
These pins are internally clamped to V
This pin is clamped low to V
Maximum ambient temperature is package dependent.
10
11
12
13
14
15
1
2
3
4
5
6
7
8
9
ESD Protection and Latch-Up Immunity
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
PLL Supply Voltage
Voltage difference V
Voltage difference V
Digital I/O Input Voltage
Analog Reference
XFC, EXTAL, XTAL inputs
TEST input
Instantaneous Maximum Current
Single pin limit for all digital I/O pins
Instantaneous Maximum Current
Single pin limit for XFC, EXTAL, XTAL
Instantaneous Maximum Current
Single pin limit for TEST
Operating Temperature Range (ambient)
Operating Temperature Range (junction)
Storage Temperature Range
Table A-1. Absolute Maximum Ratings
DDX
SSX
1
SSPLL
Rating
to V
to V
4
, but not clamped high. This pin must be tied low in applications.
1
SSR
DDR
MC9S12NE64 Data Sheet, Rev. 1.1
SSPLL
and V
and V
2
and V
SSX
3
SSA
DDA
and V
DDPLL
DDX
.
, V
DDR
Symbol
V
V
∆
∆
V
RH,
V
DDPLL
V
V
VDDX
T
VSSX
V
TEST
I
or V
I
T
T
DD3
I
DL
DT
DD
ILV
stg
D
IN
A
J
V
RL
SSA
and V
–0.25
Min
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–25
–25
–40
–40
–65
DDA
.
Freescale Semiconductor
105
Max
10.0
+25
+25
140
155
4.5
3.0
3.0
0.3
0.3
6.5
6.5
3.0
0
5
Unit
mA
mA
mA
°C
°C
°C
V
V
V
V
V
V
V
V
V