D13003TF16V Renesas Electronics America, D13003TF16V Datasheet - Page 527

• Manufacturer Part Number: D13003TF16V
• Description: IC H8/3003 ROMLESS 112QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13003TF16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 50
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Table 16-2 Crystal Resonator Parameters
Frequency (MHz)
Rs max (Ω)
Co (pF)
Clock-Halving Version: Use a crystal resonator with a frequency equal to twice the system clock
frequency (ø).
1:1 Version: Use a crystal resonator with a frequency equal to the system clock frequency (ø).
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 16-4.
When the board is designed, the crystal resonator and its load capacitors should be placed as close
as possible to the XTAL and EXTAL pins.
Avoid
C
C
L2
L1
Figure 16-4 Example of Incorrect Board Design
2
500
4
120
Signal A
8
80
507
Signal B
10
70
7 pF max
12
60
XTAL
EXTAL
H8/3003
16
50
20
40
24
40