D13003TF16V Renesas Electronics America, D13003TF16V Datasheet - Page 536

• Manufacturer Part Number: D13003TF16V
• Description: IC H8/3003 ROMLESS 112QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13003TF16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 50
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

17.4.3 Selection of Waiting Time for Exit from Software Standby Mode
Bits STS2 to STS0 in SYSCR should be set as follows.
Crystal Resonator: Set STS2 to STS0 so that the waiting time (for the clock to stabilize) is at
least 8 ms. Table 17-3 indicates the waiting times that are selected by STS2 to STS0 settings at
various system clock frequencies.
External Clock: Any value may be set in the clock-halving version. Normally the minimum value
(STS2 = STS1 = STS0 = 1) is recommended. In the 1:1 clock version, any value other than the
minimum value may be set.
Table 17-3 Clock Frequency and Waiting Time for Clock to Settle
STS2 STS1 STS0 Time
0
0
0
0
1
1
Note: * This setting cannot be used in the 1:1 clock version.
0
0
1
1
0
1
: Recommended setting
0
1
0
1
—
—
Waiting
8192
states
16384
states
32768
states
65536
states
131072
states
4 states* 0.25
16 MHZ 12 MHz 10 MHz 8 MHz 6 MHz 4 MHz 2 MHz Unit
0.51
1.0
2.0
4.1
8.2
0.65
1.3
2.7
5.5
10.9
0.33
516
0.8
1.6
3.3
6.6
13.1
0.4
1.0
2.0
4.1
8.2
16.4
0.5
1.3
2.7
5.5
10.9
21.8
0.67
2.0
4.1
8.2
16.4
32.8
1.0
4.1
8.2
16.4
32.8
65.5
2.0
µs
ms