ST72C215G2M6 STMicroelectronics, ST72C215G2M6 Datasheet - Page 132

IC MCU 8BIT 8K FLASH SOIC-28

ST72C215G2M6

Manufacturer Part Number
ST72C215G2M6
Description
IC MCU 8BIT 8K FLASH SOIC-28
Manufacturer
STMicroelectronics
Series
ST7r
Datasheets

Specifications of ST72C215G2M6

Core Processor
ST7
Core Size
8-Bit
Speed
16MHz
Connectivity
SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3.2 V ~ 5.5 V
Data Converters
A/D 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
ST7
No. Of I/o's
22
Ram Memory Size
256Byte
Cpu Speed
8MHz
No. Of Timers
2
Rohs Compliant
Yes
Processor Series
ST72C2x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SPI
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Operating Supply Voltage
3.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7MDT1-DVP2/US
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
In Transition

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ST72104G, ST72215G, ST72216G, ST72254G
15.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in
Figure 99. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 100. Recommended Reflow Soldering Oven Profile (MID JEDEC)
132/140
Temp. [°C]
Temp. [°C]
250
200
150
100
250
200
150
100
50
50
0
0
PREHEATING
PHASE
Figure 99
ramp up
2°C/sec for 50sec
20
90 sec at 125°C
80°C
and
100
40
Figure
SOLDERING
PHASE
100.
60
5 sec
200
150 sec above 183°C
80
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
Heraeus: PD945, PD955
Loctite: 3615, 3298
100
ramp down natural
2°C/sec max
COOLING PHASE
(ROOM TEMPERATURE)
Tmax=220+/-5°C
for 25 sec
300
120
140
400
160
Time [sec]
Time [sec]

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