STM32F101VDT6 STMicroelectronics, STM32F101VDT6 Datasheet - Page 88

MCU ARM 32BIT 384K FLASH 100LQFP

STM32F101VDT6

Manufacturer Part Number
STM32F101VDT6
Description
MCU ARM 32BIT 384K FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101VDT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
48 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM3210E-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Electrical characteristics
88/106
The formula above
error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).
Table 54.
1. Guaranteed by design, not tested in production.
Table 55.
1. ADC DC accuracy values are measured after internal calibration.
2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
3. Based on characterization, not tested in production.
1.5
7.5
13.5
28.5
41.5
55.5
71.5
239.5
Symbol
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
T
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
s
R
(cycles)
ADC accuracy - limited test conditions
AIN
(Equation
Parameter
max for f
1) is used to determine the maximum external impedance allowed for an
ADC
Doc ID 14610 Rev 7
0.11
0.54
0.96
2.04
2.96
3.96
5.11
17.1
= 14 MHz
f
f
V
Measurements made after
ADC calibration
V
PCLK2
ADC
DDA
REF+
= 14 MHz, R
(1)
= 3 V to 3.6 V, T
t
STM32F101xC, STM32F101xD, STM32F101xE
= V
S
= 28 MHz,
Test conditions
(µs)
DDA
INJ(PIN)
AIN
(1)(2)
and I
< 10 k,
A
= 25 °C
INJ(PIN)
0.4
5.9
11.4
25.2
37.2
50
NA
NA
in
±1.3
±0.5
±0.7
±0.8
Typ
±1
Section 5.3.13
R
AIN
max (k)
Max
±1.5
±1.5
±1.5
±1
±2
(3)
does not
Unit
LSB

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