MC68HC908JB16DW Freescale Semiconductor, MC68HC908JB16DW Datasheet - Page 327

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MC68HC908JB16DW

Manufacturer Part Number
MC68HC908JB16DW
Description
IC MCU 16K FLASH 6MHZ USB 28SOIC
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC68HC908JB16DW

Core Processor
HC08
Core Size
8-Bit
Speed
6MHz
Connectivity
SCI, USB
Peripherals
LED, LVD, POR, PWM
Number Of I /o
21
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

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Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC908JB16DW
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC68HC908JB16DWE
Manufacturer:
MOTOROLA/摩托罗拉
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21.4 28-Pin Small Outline Integrated Circuit (SOIC)
MC68HC908JB16
Freescale Semiconductor
28
1
28X
26X
0.010 (0.25)
D
G
Rev. 1.1
-A-
M
T
A
Figure 21-2. 28-Pin SOIC (Case #751F)
S
B
S
14
15
K
-B-
Mechanical Specifications
C
SEATING
PLANE
-T-
R
14X
X 45
P
0.010 (0.25)
M
B
M
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
17.80
10.01
MILLIMETERS
Mechanical Specifications
MIN
7.40
2.35
0.35
0.41
0.23
0.13
0.25
0
1.27 BSC
18.05
10.55
MAX
7.60
2.65
0.49
0.90
0.32
0.29
0.75
8
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0.395
0.010
MIN
0.050 BSC
0
INCHES
Technical Data
MAX
0.711
0.299
0.104
0.019
0.035
0.013
0.011
0.415
0.029
8
327

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