MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 102

• Manufacturer Part Number: MCIMX253CVM4
• Description: IC MPU I.MX25 IND 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX253CVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

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In cases where SDMA TAP is put in the chain, the maximum TCK frequency is limited by the maximum ratio of 1:8 of SDMA
core frequency to TCK. This implies a maximum frequency of 8.25 MHz (or 121.2 ns) for a 66 MHz IPG clock.
V
SJ10
SJ11
SJ12
SJ13
SJ1
SJ2
SJ3
SJ4
SJ5
SJ6
SJ7
SJ8
SJ9
M –
ID
mid point voltage
(Input)
TCK cycle time
TCK clock pulse width measured at
TCK rise and fall times
Boundary scan input data set-up time
Boundary scan input data hold time
TCK low to output data valid
TCK low to output high impedance
TMS, TDI data set-up time
TMS, TDI data hold time
TCK low to TDO data valid
TCK low to TDO high impedance
TRST assert time
TRST set-up time to TCK low
TRST
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
(Input)
TCK
SJ12
Parameter
SJ13
Table 76. SJC Timing Parameters
Figure 75. TRST Timing Diagram
V
M
2
100
Min.
100
40
10
50
10
50
40
—
—
—
—
—
All Frequencies
1
Max.
50
50
44
44
—
—
—
—
—
—
—
—
3
Freescale Semiconductor
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns