MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 35

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MCIMX253CVM4

Manufacturer Part Number
MCIMX253CVM4
Description
IC MPU I.MX25 IND 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheets

Specifications of MCIMX253CVM4

Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-LFBGA
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX253CVM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Note:
1. Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1.65 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
2. Minimum condition for tps: wcs model, 1.1 V, I/O 1.65 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
3. Maximum condition for tdit: bcs model, 1.3 V, I/O 1.95 V, and –40 °C.
4. Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.65 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
Table 23
Freescale Semiconductor
Duty cycle
Clock frequency
Output pad transition times (max. drive)
Output pad transition times (high drive)
Output pad transition times (standard drive)
Output pad propagation delay (max. drive),
50%–50% input signals and crossing of
output signals
Output pad propagation delay (high drive),
50%–50% input signals and crossing of
output signals
Output pad propagation delay (standard
drive), 50%–50% input signals and crossing
of output signals
Output pad propagation delay (max. drive),
40%–60% input signals and crossing of
output signals
Output pad propagation delay (high drive),
40%–60% input signals and crossing of
output signals
Output pad propagation delay (standard
drive), 40%–60% input signals and crossing
of output signals
Output enable to output valid delay (max.
drive), 50%–50%
Output enable to output valid delay (high
drive), 50%–50%
Output enable to output valid delay
(standard drive), 50%–50%
bcs model, 1.3 V, I/O 1.95 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
between VIH to VIL for falling edge.
I/O 1.95 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
shows the AC parameters for mobile DDR pbijtov18_33_ddr_clk I/O.
Parameter
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
Table 23. AC Parameters for Mobile DDR pbijtov18_33_ddr_clk I/O
Symbol
Fduty
tpo
tpo
tpo
tpo
tpo
tpo
tpv
tpv
tpv
tpr
tpr
tpr
f
Condition
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
Load
Rise/Fall
0.52/0.51
0.98/0.96
1.13/1.10
2.15/2.10
2.26/2.19
4.30/4.18
1.28/1.19
1.56/1.47
1.54/1.43
2.14/2.04
2.05/1.94
3.27/3.16
1.45/1.36
1.73/1.64
1.70/1.60
2.31/2.21
2.22/2.11
3.43/3.32
1.16/1.12
1.42/1.41
1.39/1.39
1.98/2.02
1.90/1.94
3.07/3.20
Min.
40
0.79/0.72
1.49/1.34
1.74/1.55
3.28/2.92
3.46/3.07
6.59/5.79
1.97/1.83
2.37/2.23
2.34/2.20
3.22/3.08
3.11/2.96
4.86/4.72
2.13/2.00
2.53/2.40
2.51/2.37
3.38/3.24
3.27/3.13
5.02/4.88
1.91/1.81
2.31/2.20
2.28/2.18
3.18/3.04
3.09/2.94
4.88/4.66
Typ.
50
10.13/8.55
1.25/1.09
2.31/1.98
2.71/2.30
5.11/4.31
5.39/4.56
2.98/2.78
3.57/3.37
3.54/3.33
4.85/4.65
4.70/4.50
7.33/7.12
3.14/2.94
3.74/3.54
3.70/3.50
5.02/4.82
4.87/4.66
7.49/7.29
3.10/2.89
3.72/3.47
3.69/3.43
5.08/4.69
4.95/4.55
7.73/7.05
Rise/Fall
Max.
133
60
Units
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
%
Notes
1
1
1
1
1
35

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