MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 133

• Manufacturer Part Number: MCIMX253CVM4
• Description: IC MPU I.MX25 IND 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX253CVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

4.5
Figure 99
Freescale Semiconductor
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All dimensions in millimeters.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Parallelism measurement shall exclude any effect of mark on package’s top surface.
347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch
shows the 12 12 mm i.MX25 production package. The following notes apply to
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
Figure 99. 12 12 mm i.MX25 Production Package
Figure
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