MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 67

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MCIMX253CVM4

Manufacturer Part Number
MCIMX253CVM4
Description
IC MPU I.MX25 IND 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheets

Specifications of MCIMX253CVM4

Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-LFBGA
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX253CVM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
2
3
Freescale Semiconductor
1
DQ Slew Rate
DDR24 DQS - DQ Skew (defines the Data valid window in read cycles related to DQS)
DDR25 DQS DQ in HOLD time from DQS
DDR26 DQS output access time from SDCLK posedge
All units in ‘ps’.
Test conditions are at capacitance=15pF for DDR PADS. Recommended drive strengths are medium for SDCLK and high for
address and controls.
SDRAM CLK and DQS related parameters are measured from the 50% point. That is, high is defined as 50% of the signal
value, and low is defined as 50% of the signal value. DDR SDRAM CLK parameters are measured at the crossing point of
SDCLK and SDCLK (inverted clock).
Test conditions are at capacitance=15 pF for DDR PADS. Recommended drive strengths are medium for SDCLK and high for
address and controls.
ID
V/ns
DQS (input)
SDCLK_B
DQ (input)
SDCLK
Table 51. tDS1, tDH1 Derating Values for DDR2-400, DDR2-533
2.0 188
1.5 146
1.0 63
0.9
0.8
0.7
0.6
0.5
0.4
Figure 33. DDR2 SDRAM DQ vs. DQS and SDCLK READ Cycle Timing Diagram
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
188 167 146 125
167 125 125
125
Table 52. DDR2 SDRAM Read Cycle Parameter Table
DDR26
42
31
83
69
DDR24
DATA
3
–11 –14 –13 –13 –18 –27 –29 –45
–25 –31 –27 –30 –32 –44 –43 –62 –60 –86
83
0
Parameter
63
42
0
DATA
–45 –53 –50 –67 –61 –85 –78 –109 –108 –152
81
–2
DQS Single-Ended Slew Rate
DDR25
43
1
DATA
–74 –96 –85 –114 –102 –138 –132 –181 –183 –246
–7
DATA
–13
–128 –156 –145 –180 –175 –223 –226 –288
DATA
–210 –243 –240 –286 –291 –351
1,2,3
DATA
1,2
Symbol
(continued)
t
t
DQSCK
DQSQ
t
QH
DATA
2.925
Min. Max.
–0.5
DDR2-400
DATA
0.35
0.5
Unit
ns
ns
ns
67

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