MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 141

• Manufacturer Part Number: MCIMX253CVM4
• Description: IC MPU I.MX25 IND 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX253CVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

5
Table 106
Freescale Semiconductor
Rev.
6
5
4
3
2
1
0
Revision History
summarizes revisions to this document.
09/2010 • Added
08/2010 • Updated
06/2010 • Updated
03/2010 • Updated
12/2009 • Updated
10/2009 • Updated
6/2009 Initial release.
Date
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
• Updated
• Added
• Added
• Added
• Added
• Added
• Added
• Updated DRYICE description in
• Updated REF signal description in
• Updated ESD damage immunity values in
• Updated values in
• Added a note on timing in
• Added
• Updated
• Updated values in
• Updated
FUSE_VDD.
0.5 mm Pitch.”
Section 4.6, “Ground, Power, Sense, and Reference Contact Assignments Case 12x12 mm,
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Table
Section 3.3, “Power Characteristics.”
Section 4.5, “347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch.”
Section 4.7, “Signal Contact Assignments—12 x 12 mm, 0.5 mm Pitch.”
Section 4.8, “i.MX25 12x12 Package Ball Map.”
Table
Table 54, "WEIM Bus Timing Parameters," on page 71
Table 6, "DC Operating Conditions," on page 11
Table
Table
Table
Table 1, “Ordering Information,”
Table
Table
2,
12,
1,
1,
1,
53,
83,
“i.MX25 Parts Functional Differences.”
“iMX25 Reduced Power Mode Current Consumption.”
“Ordering Information,”
“Ordering Information,”
“Ordering Information,”
Table 106. Revision History
Table
Table
“NFC Timing Parameters.”
“Touchscreen ADC Electrical Specifications.”
11,
54,
Section 3.2.1, “Power-Up Sequence.”
“i.MX25 Power Mode Current Consumption.”
“WEIM Bus Timing Parameters.
Table
Table
3,
“i.MX25 Digital and Analog Modules.”
to include new part numbers.
to include new part numbers.
to include new part numbers.
to include new part numbers.
4,
Table
Revision
“Signal Considerations.”
5,
“DC Absolute Maximum Ratings.”
to include Min and Max values of
to include new row for WE19.
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