MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 125

• Manufacturer Part Number: MCIMX253CVM4
• Description: IC MPU I.MX25 IND 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX253CVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

4.2
Table 100
Freescale Semiconductor
•
•
•
Contact Name
NGND_ADC
MPLL_GND
FUSE_VDD
MPLL_VDD
Maximum solder bump diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
Parallelism measurement shall exclude any effect of mark on top surface of package.
BATT_VDD
Table 100. 17×17 mm Package Ground, Power Sense, and Reference Contact Assignments
Ground, Power, Sense, and Reference Contact Assignments
Case 17x17 mm, 0.8 mm Pitch
shows the 17×17 mm package ground, power, sense, and reference contact assignments.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
P10
T17
U17
U18
Y13
Figure 98.
zzxz
17×17 i.MX25 Production Package
Contact Assignment
125