MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 19

• Manufacturer Part Number: MCIMX253CVM4
• Description: IC MPU I.MX25 IND 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX253CVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

The method for obtaining the maximum current is as follows:
3.4
The thermal resistance characteristics for the device are given in
under the following conditions:
Freescale Semiconductor
1
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,
USBPHY1_VDDA, USBPHY2_VDD,
OSC24M_VDD, NVCC_ADC
FUSE_VDD
BATT_VDD
The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed.
1. Measure the worst case power consumption on individual rails using directed test on i.MX25.
2. Correlate the worst case power consumption power measurements with the worst case power
3. Combine common voltage rails based on the power supply sequencing requirements (add the
4. Guard the worst case numbers for temperature and process variation.
5. The sum of individual rails is greater than the real world power consumption, since a real
6. BATT_VDD current is measured when the system is in reduced power mode maintaining the
•
•
•
•
•
•
consumption simulations.
worst case power consumption on each rail within some test cases from several test cases run, to
maximize different rails in the power group).
system does not typically maximize the power consumption on all peripherals
simultaneously.
RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current
becomes negligible. Refer to
Two-layer substrate
Substrate solder mask thickness: 0.025 mm
Substrate metal thicknesses: 0.016 mm
Substrate core thickness: 0.200 mm
Core through I.D: 0.118 mm, Core through plating 0.016 mm.
Flag: Trace style with ground balls under the die connected to the flag
Thermal Characteristics
1
The values mentioned above should not be taken as a typical max run data
for specific use cases. These values are Absolute MAX data. Freescale
recommends that the system current measurements are taken with
customer-specific use-cases to reflect normal operating conditions in the
end system
Power Supply
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
Table 15. Power Consumption (continued)
Table
12, for more details on the power modes.
NOTE
Voltage (V)
1.55
3.3
3.6
Table
16. These values are measured
Max Current (mA)
0.030
40
62
19