LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 37

LPC2364HBD100/LQFP100/TRAYBDP/

LPC2364HBD100

Manufacturer Part Number
LPC2364HBD100
Description
LPC2364HBD100/LQFP100/TRAYBDP/
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2364HBD100

Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LQFP
Processor Series
LPC23
Core
ARM7TDMI-S
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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NXP Semiconductors
8. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
LPC2364_65_66_67_68_6
Product data sheet
Symbol
V
V
V
V
V
V
V
I
I
T
P
V
DD
SS
stg
DD(3V3)
DD(DCDC)(3V3)
DDA
i(VBAT)
i(VREF)
IA
I
tot(pack)
ESD
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Including voltage on outputs in 3-state mode.
Not to exceed 4.6 V.
The peak current is limited to 25 times the corresponding maximum current.
Dependent on package type.
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Limiting values
Parameter
supply voltage (3.3 V)
DC-to-DC converter supply voltage
(3.3 V)
analog 3.3 V pad supply voltage
input voltage on pin VBAT
input voltage on pin VREF
analog input voltage
input voltage
supply current
ground current
storage temperature
total power dissipation (per package)
electrostatic discharge voltage
Rev. 06 — 1 February 2010
Conditions
core and external
rail
for the RTC
on ADC related
pins
5 V tolerant I/O
pins; only valid
when the V
supply voltage is
present
other I/O pins
per supply pin
per ground pin
based on package
heat transfer, not
device power
consumption
human body
model; all pins
DD(3V3)
[1]
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[2][3]
[2]
[4]
[4]
[5]
[6]
Min
3.0
3.0
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
-
−40
-
−2500
Max
3.6
3.6
+4.6
+4.6
+4.6
+5.1
+6.0
V
0.5
100
100
+125
1.5
+2500
DD(3V3)
© NXP B.V. 2010. All rights reserved.
+
SS
Unit
V
V
V
V
V
V
V
V
mA
mA
°C
W
V
unless
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