GS8161Z36BGD-250 GSI TECHNOLOGY, GS8161Z36BGD-250 Datasheet - Page 31

• Manufacturer Part Number: GS8161Z36BGD-250
• Manufacturer: GSI TECHNOLOGY

Specifications of GS8161Z36BGD-250

• Density: 18Mb
• Access Time (max): 5.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 181MHz
• Operating Supply Voltage (typ): 2.5/3.3V
• Address Bus: 19b
• Package Type: FBGA
• Operating Temp Range: 0C to 70C
• Number Of Ports: 4
• Supply Current: 235mA
• Operating Supply Voltage (min): 2.3/3V
• Operating Supply Voltage (max): 2.7/3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 165
• Word Size: 36b
• Number Of Words: 512K
• Lead Free Status / Rohs Status: Compliant

JTAG TAP Instruction Set Summary
Rev: 1.05a 10/2009
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Notes:
1.
2.
Instruction
SAMPLE-Z
PRELOAD
Instruction codes expressed in binary, MSB on left, LSB on right.
Default instruction automatically loaded at power-up and in test-logic-reset state.
SAMPLE/
EXTEST
IDCODE
BYPASS
RFU
RFU
GSI
Code
000
001
010
011
100
101
110
111
Places the Boundary Scan Register between TDI and TDO.
Preloads ID Register and places it between TDI and TDO.
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
Forces all RAM output drivers to High-Z.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
GSI private instruction.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
Places Bypass Register between TDI and TDO.
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GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
Description
© 2004, GSI Technology
Notes
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