GS8161Z36BGD-250 GSI TECHNOLOGY, GS8161Z36BGD-250 Datasheet - Page 34

• Manufacturer Part Number: GS8161Z36BGD-250
• Manufacturer: GSI TECHNOLOGY

Specifications of GS8161Z36BGD-250

• Density: 18Mb
• Access Time (max): 5.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 181MHz
• Operating Supply Voltage (typ): 2.5/3.3V
• Address Bus: 19b
• Package Type: FBGA
• Operating Temp Range: 0C to 70C
• Number Of Ports: 4
• Supply Current: 235mA
• Operating Supply Voltage (min): 2.3/3V
• Operating Supply Voltage (max): 2.7/3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 165
• Word Size: 36b
• Number Of Words: 512K
• Lead Free Status / Rohs Status: Compliant

TQFP Package Drawing (Package T)
Rev: 1.05a 10/2009
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Notes:
1.
2.
Symbol
A1
A2
D1
E1
L1
All dimensions are in millimeters (mm).
Package width and length do not include mold protrusion.
D
E
Y

b
c
e
L
Terminal Dimension
Terminal Dimension
Body Thickness
Lead Thickness
Description
Package Body
Package Body
Lead Length
Foot Length
Lead Width
Coplanarity
Lead Angle
Lead Pitch
Standoff
Min. Nom. Max
0.05
1.35
0.20
0.09
21.9
19.9
15.9
13.9
0.45
—
—
0
0.10
1.40
0.30
22.0
20.0
16.0
14.0
0.65
0.60
1.00
—
—
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
0.75
0.10
—
—
7
34/38
GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
L1
A1
L
e
b
A2

c
E1
E
© 2004, GSI Technology