EP2SGX60EF1152C3N Altera, EP2SGX60EF1152C3N Datasheet - Page 132

IC STRATIX II GX 60K 1152-FBGA

EP2SGX60EF1152C3N

Manufacturer Part Number
EP2SGX60EF1152C3N
Description
IC STRATIX II GX 60K 1152-FBGA
Manufacturer
Altera
Series
Stratix® II GXr
Datasheet

Specifications of EP2SGX60EF1152C3N

Number Of Logic Elements/cells
60440
Number Of Labs/clbs
3022
Total Ram Bits
2544192
Number Of I /o
534
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-2181

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I/O Structure
2–124
Stratix II GX Device Handbook, Volume 1
f
These dedicated circuits combined, with enhanced PLL clocking and
phase-shift ability, provide a complete hardware solution for interfacing
to high-speed memory.
For more information on external memory interfaces, refer to the
External Memory Interfaces in Stratix II & Stratix II GX Devices
volume 2 of the Stratix II GX Device Handbook.
Programmable Drive Strength
The output buffer for each Stratix II GX device I/O pin has a
programmable drive strength control for certain I/O standards. The
LVTTL, LVCMOS, SSTL, and HSTL standards have several levels of drive
strength that you can control. The default setting used in the Quartus II
software is the maximum current strength setting that is used to achieve
maximum I/O performance. For all I/O standards, the minimum setting
is the lowest drive strength that guarantees the I
Using minimum settings provides signal slew rate control to reduce
system noise and signal overshoot.
OH
/I
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Altera Corporation
of the standard.
October 2007
chapter in

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