SPC5200CBV400B Freescale Semiconductor, SPC5200CBV400B Datasheet - Page 7

• Manufacturer Part Number: SPC5200CBV400B
• Description: IC MPU 32BIT 500MHZ 272PBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC603er

Specifications of SPC5200CBV400B

• Processor Type: MPC52xx PowerPC 32-Bit
• Speed: 400MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 272-PBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 400MHz
• Embedded Interface Type: I2C, SPI, USB
• Digital Ic Case Style: BGA
• No. Of Pins: 272
• Rohs Compliant: No
• Family Name: MPC52xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.58V
• Operating Supply Voltage (min): 1.42V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

1.1.4
1.1.5
Power dissipation of the MPC5200B is caused by 3 different components: the dissipation of the internal or core digital logic
(supplied by VDD_CORE), the dissipation of the analog circuitry (supplied by SYS_PLL_AVDD and CORE_PLL_AVDD)
and the dissipation of the IO logic (supplied by VDD_IO_MEM and VDD_IO).
analog power dissipation figures for a range of operating modes. However, the dissipation due to the switching of the IO pins
can not be given in general, but must be calculated by the user for each application case using the following formula:
where N is the number of output pins switching in a group M, C is the capacitance per pin, VDD_IO is the IO voltage swing, f
is the switching frequency and PIOint is the power consumed by the unloaded IO stage. The total power consumption of the
MPC5200B processor must not exceed the value, which would cause the maximum junction temperature to be exceeded.
Freescale Semiconductor
V
V
Sym
V
I
I
CDM
HBM
LAT
LAT
MM
Machine Model (MM)—JEDEC JESD22-A115
Charge Device Model (CDM)—JEDEC JESD22-C101
Latch-up Current at T
positive
negative
Latch-up Current at T
positive
negative
Human Body Model (HBM)—JEDEC JESD22-A114-B
Electrostatic Discharge
Power Dissipation
This device contains circuitry that protects against damage due to high-static voltage or
electrical fields. However, it is advised that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages. Operational
reliability is enhanced if unused inputs are tied to an appropriate logic voltage level (GND
or V
CC
).
Table 7
Table 5. ESD and Latch-Up Protection Characteristics
A
A
gives package thermal characteristics for this device.
=85
=27
P IO
o
o
C
C
=
P
P IOint
total
Rating
MPC5200B Data Sheet, Rev. 4
=
P
+
core
∑
M
CAUTION
N
+
×
P
analog
C
×
VDD_IO
+
P
IO
2
×
Table 6
f
2000
+100
–100
+200
–200
Min
200
500
details typical measured core and
Max
—
—
—
—
—
Unit
mA
mA
V
V
V
SpecID
D4.1
D4.2
D4.3
D4.4
D4.5
Eqn. 1
Eqn. 2
7