MPC8321CVRAFDC Freescale Semiconductor, MPC8321CVRAFDC Datasheet - Page 49

• Manufacturer Part Number: MPC8321CVRAFDC
• Description: IC MPU PWRQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8321CVRAFDC

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 333MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8323E-MDS-PB
• Maximum Clock Frequency: 333 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 16 KB
• I/o Voltage: 1.8 V, 3.3 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see
MPC8323E PBGA,”
information on the PBGA.
21.1
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516
PBGA.
21.2
Figure 42
516-PBGA package.
Freescale Semiconductor
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8323E PBGA
Mechanical Dimensions of the MPC8323E PBGA
shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
and
Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,”
516
1.00 mm
2.25 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
0.6 mm
27 mm × 27 mm
Section 21.1, “Package Parameters for the
Package and Pin Listings
for
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