UPD61052 NEC, UPD61052 Datasheet - Page 103

• Manufacturer Part Number: UPD61052
• Description: MPEG2 Audio / Video Encoder
• Manufacturer: NEC

8.
representative.
Notes 1. Lead-free product
Caution Do not use two or more soldering methods in combination (except for partial heating method).
µ
µ
µ
µ
Infrared reflow
VPS
Partial heating
PD61051GD-LML:
PD61051GD-LML-A
PD61052GD-LML:
PD61052GD-LML-A
Soldering Method
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
RECOMMENDED SOLDERING CONDITIONS
2. After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
µ
PD61051, 61052 should be soldered and mounted under the following recommended conditions.
Package peak temperature: 235°C
Time: 30 sec. max. (at 210°C or higher)
Count: Three times or fewer
Exposure limit: 7 days
Package peak temperature: 215°C
Time: 40 sec. max. (at 200°C or higher)
Count: Three times or fewer
Exposure limit: 7 days
Pin temperature: 300°C max.
Time: 3 sec. max. (per pin row)
Note1
Note1
:
:
208-pin plastic QFP (Fine pitch) (28×28)
208-pin plastic QFP (Fine pitch) (28×28)
208-pin plastic QFP (Fine pitch) (28×28)
208-pin plastic QFP (Fine pitch) (28×28)
Table 8-1. Surface-Mounted Soldering Conditions
Note2
Note2
(After that, prebake at 125°C for 20 to 72 hours)
(After that, prebake at 125°C for 20 to 72 hours)
Data Sheet S15082EJ4V0DS
Soldering Conditions
µ
PD61051, 61052
Condition Symbol
Recommended
VP15-207-3
IR35-207-3
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