LTC3829EFE#PBF Linear Technology, LTC3829EFE#PBF Datasheet - Page 38

• Manufacturer Part Number: LTC3829EFE#PBF
• Description: IC BUCK SYNC ADJ 38TSSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3829EFE#PBF

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.6 ~ 5 V
• Frequency - Switching: 250kHz ~ 770kHz
• Voltage - Input: 4.5 ~ 38 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 38-TSSOP Exposed Pad, 38-eTSSOP, 38-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Power - Output: -

LTC3829
package DescripTion

7.00 0.10
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5.50 0.05
OUTLINE M0-220 VARIATION WHKD
4.10 0.05
PIN 1
TOP MARK
(SEE NOTE 6)
3.00 REF
5.00 0.10
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.15 ± 0.05
RECOMMENDED SOLDER PAD LAYOUT
(Reference LTC DWG # 05-08-1701 Rev C)
38-Lead Plastic QFN (5mm × 7mm)
5.15 ± 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
0.25 0.05
6.10 0.05
7.50 0.05
0.75 0.05
5.5 REF
UHF Package
5.50 REF
0.00 – 0.05
0.200 REF
0.50 BSC
0.25 0.05
BOTTOM VIEW—EXPOSED PAD
0.70 0.05
5.15 ± 0.10
PACKAGE
OUTLINE
3.15 ± 0.10
3.00 REF
R = 0.125
TYP
37
38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 45 CHAMFER
R = 0.10
TYP
0.40 0.10
1
2
(UH) QFN REF C 1107
3829f