DF2437FV Renesas Electronics America, DF2437FV Datasheet - Page 646

IC H8S/2437 MCU FLASH 128QFP

DF2437FV

Manufacturer Part Number
DF2437FV
Description
IC H8S/2437 MCU FLASH 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheets

Specifications of DF2437FV

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2437FV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
5. Memory sizes of the user MAT and user boot MAT are different. When accessing the user
Rev.2.00 May. 28, 2009 Page 606 of 732
REJ09B0059-0200
boot MAT, do not access addresses above the top of its 8-kbyte memory space. If an access is
made beyond the 8-kbyte space, the undefined value will be read.
<User
Figure 20.17 Switching between User MAT and User Boot MAT
MAT>
Procedure for switching to the user boot MAT
(1) Mask interrupts
(2) Write H'AA to FMATS.
(3) Execute four NOP instructions before
Procedure for switching to the user MAT
(1) Mask interrupts
(2) Write a value other than H'AA to FMATS.
(3) Execute four NOP instructions before accessing
accessing the user boot MAT.
the user MAT.
<On-chip RAM>
switching to the
Procedure for
user boot MAT
the user MAT
Procedure for
switching to
<User boot MAT>

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