D6417760BP200ADV Renesas Electronics America, D6417760BP200ADV Datasheet - Page 407

IC SUPER H MPU ROMLESS 256BGA

D6417760BP200ADV

Manufacturer Part Number
D6417760BP200ADV
Description
IC SUPER H MPU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of D6417760BP200ADV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D6417760BP200ADV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 10 Bus State Controller (BSC)
(4) Single Read
The timing chart for a single read is shown in figure 10.17. In this LSI, since synchronous DRAM
is set to burst read/burst write mode, read data continues to be output even after the required data
has been received. To prevent data collisions, after the required data is read in cycle Td1, dummy
read cycles Td2 to Td4 are performed, and this LSI waits for the end of the synchronous DRAM
operation.
There are 4 burst transfers during a read. In cache-through and other DMA read cycles, the BS
signal is asserted and data is latched only in cycle Td1 of cycles Td1 to Td4.
Such dummy cycles increase the memory access time and tend to reduce program execution speed
and DMA transfer speed. It is important both to avoid access to unnecessary cache-through areas
and to use a data structure that allows data to be placed at a 32-byte boundary for transfer in 32-
byte units when carrying out DMA transfer with synchronous DRAM specified as the source.
Rev. 2.00 Feb. 12, 2010 Page 323 of 1330
REJ09B0554-0200

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