PIC18F2221-I/SS Microchip Technology, PIC18F2221-I/SS Datasheet - Page 27

• Manufacturer Part Number: PIC18F2221-I/SS
• Description: IC PIC MCU FLASH 2KX16 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2221-I/SS

• Core Size: 8-Bit
• Program Memory Size: 4KB (2K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• Controller Family/series: PIC18
• No. Of I/o's: 25
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 512Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Package: 28SSOP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164307 - MODULE SKT FOR PM3 28SSOP
• Lead Free Status / Rohs Status: Details

2.4
The PGC and PGD pins are used for In-Circuit Serial
Programming (ICSP) and debugging purposes. It is
recommended to keep the trace length between the
ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is recom-
mended, with the value in the range of a few tens of
ohms, not to exceed 100Ω.
Pull-up resistors, series diodes and capacitors on the
PGC and PGD pins are not recommended as they will
interfere
munications to the device. If such discrete components
are an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective device
Flash programming specification for information on
capacitive loading limits and pin input voltage high (V
and input low (V
For device emulation, ensure that the “Communication
Channel Select” (i.e., PGC/PGD pins) programmed
into the device matches the physical connections for
the ICSP to the MPLAB
ICE™ emulator.
For more information on the ICD 2, ICD 3 and REAL
ICE emulator connection requirements, refer to the
following documents that are available on the
Microchip web site.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
2.5
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
© 2009 Microchip Technology Inc.
Guide” (DS51331)
Guide” (DS51616)
(poster) (DS51749)
ICSP Pins
External Oscillator Pins
®
®
®
®
with
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” (DS51566)
ICD 3 Design Advisory” (DS51764)
REAL ICE™ In-Circuit Emulator User’s
IL
®
®
®
) requirements.
secondary
the
ICD 2” (poster) (DS51265)
ICD 3” (poster) (DS51765)
REAL ICE™ In-Circuit Emulator”
PIC18F2221/2321/4221/4321 FAMILY
®
programmer/debugger
ICD 2, MPLAB ICD 3 or REAL
oscillator
(refer
com-
IH
to
)
Use a grounded copper pour around the oscillator
circuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a
two-sided board, avoid any traces on the other side of
the board where the crystal is placed. A suggested
layout is shown in Figure 2-3.
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
• AN849, “Basic PICmicro
• AN943, “Practical PICmicro
• AN949, “Making Your Oscillator Work”
FIGURE 2-3:
2.6
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 kΩ
to 10 kΩ resistor to V
output to logic low.
Selection for rfPIC™ and PICmicro
and Design”
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
Unused I/Os
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
SS
on unused pins and drive the
®
Oscillator Design”
®
Oscillator Analysis
DS39689F-page 27
®
Devices”
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