DSPIC30F2020-30I/MM Microchip Technology, DSPIC30F2020-30I/MM Datasheet - Page 285

• Manufacturer Part Number: DSPIC30F2020-30I/MM
• Description: IC DSPIC MCU/DSP 12K 28QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2020-30I/MM

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-QFN
• Core Frequency: 15MHz
• Core Supply Voltage: 3.3V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 21
• Flash Memory Size: 12KB
• Supply Voltage Range: 3V To 3.6V
• Package: 28QFN-S EP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2006 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F2020AT-30I/SO = 30 MIPS, Industrial temp., SOIC package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 2 0 2 0 AT - 3 0 I / S O - E S
Preliminary
dsPIC30F1010/202X
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Custom ID (3 digits) or
Engineering Sample (ES)
Package
MM = QFN
PT = TQFP
SP = SPDIP
SO = SOIC
S
W
A,B,C… = Revision Level
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70178C-page 283
Speed
20 = 20 MIPS