STR711FR2T6 STMicroelectronics, STR711FR2T6 Datasheet - Page 6

IC MCU ARM7 TDMI 256K 64-LQFP

STR711FR2T6

Manufacturer Part Number
STR711FR2T6
Description
IC MCU ARM7 TDMI 256K 64-LQFP
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet

Specifications of STR711FR2T6

Core Processor
ARM7
Core Size
32-Bit
Speed
66MHz
Connectivity
HDLC, I²C, SmartCard, SPI, UART/USART, USB
Peripherals
PWM, WDT
Number Of I /o
30
Program Memory Size
256KB (256K x 8 + 16K)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STR711x
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN/EMI/USB
Maximum Clock Frequency
66 MHz
Number Of Programmable I/os
30
Number Of Timers
4
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR7, KSK-STR711-PL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STR710-SK/HIT, STR711-SK/IAR, STR712-SK/IAR, STR71X-SK/RAIS, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 12-bit
For Use With
MCBSTR7UME - MCBSTR7 + ULINK-ME DEV KITMCBSTR7 - BOARD EVAL STM STR71X SERIES497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU497-4550 - KIT IAR STARTER STR711/STR712
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-4513

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System architecture
3
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System architecture
Package choice: low pin-count 64-pin or feature-rich 144-pin LQFP or BGA
The STR71x family is available in 5 main versions.
The 144-pin versions have the full set of all features including CAN, USB and External
Memory Interface (EMI).
The three 64-pin versions (BGA or LQFP) do not include External Memory Interface.
High speed Flash memory (STR71xF)
The Flash program memory is organized in two banks of 32-bit wide Burst Flash memories
enabling true read-while-write (RWW) operation. Device Bank 0 is up to 256 Kbytes in size,
typically for the application program code. Bank 1 is 16 Kbytes, typically used for storing
data constants. Both banks are accessed by the CPU with zero wait states @ 33 MHz
Bank 0 memory endurance is 10K write/erase cycles and Bank 1 endurance is 100K
write/erase cycles. Data retention is 20 years at 85°C on both banks. The two banks can be
accessed independently in read or write. Flash memory can be accessed in two modes:
The STR7 embedded Flash memory can be programmed using In-Circuit Programming or
In-Application programming.
IAP (in-application programming): The IAP is the ability to re-program the Flash memory
of a microcontroller while the user program is running.
ICP (in-circuit programming): The ICP is the ability to program the Flash memory of a
microcontroller using JTAG protocol while the device is mounted on the user application
board.
The Flash memory can be protected against different types of unwanted access
(read/write/erase). There are two types of protection:
Refer to the STR7 Flash Programming Reference manual for details.
Optional external memory (STR710)
The non-multiplexed 16-bit data/24-bit address bus available on the STR710 (144-pin)
supports four 16-Mbyte banks of external memory. Wait states are programmable
individually for each bank allowing different memory types (Flash, EPROM, ROM, SRAM
etc.) to be used to store programs or data.
Figure 1
STR710F: 144-pin BGA or LQFP with CAN, USB and EMI
STR710R: Flashless 144-pin BGA or LQFP with CAN, USB and EMI (no internal Flash
memory)
STR715F: 64-pin BGA or LQFP without CAN or USB
STR711F: 64-pin BGA or LQFP with USB
STR712F: 64-pin BGA or LQFP with CAN
Burst mode: 64-bit wide memory access at up to 50 MHz.
Direct 32-bit wide memory access for deterministic operation at up to 33 MHz.
Sector Write Protection
Flash Debug Protection (locks JTAG access)
shows the general block diagram of the device family.
STR71xF

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