MC9S12XEG128MAA Freescale Semiconductor, MC9S12XEG128MAA Datasheet - Page 1221
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MC9S12XEG128MAA
Manufacturer Part Number
MC9S12XEG128MAA
Description
MCU 16BIT 128K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XEG128MAA
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 12x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
80-QFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
59
Number Of Timers
25
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
No. Of I/o's
59
Eeprom Memory Size
2KB
Ram Memory Size
12KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
QFP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Quantity
Price
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Company:
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Manufacturer:
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A.2
This section describes the characteristics of the analog-to-digital converter.
A.2.1
The
The following constraints exist to obtain full-scale, full range results:
This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that
it ties to. If the input level goes outside of this range it will effectively be clipped.
1
2
3
A.2.2
Source resistance, source capacitance and current injection have an influence on the accuracy of the ATD.
A further factor is that PortAD pins that are configured as output drivers switching.
Freescale Semiconductor
Conditions are shown in
Num C
Full accuracy is not guaranteed when differential voltage is less than 4.50 V
When converting in Stop Mode (ICLKSTP=1) an ATD Stop Recovery time tATDSTPRCV is required to switch back to bus clock
based ATDCLK when leaving Stop Mode. Do not access ATD registers during this time.
The minimum time assumes a sample time of 4 ATD clock cycles. The maximum time assumes a sample time of 24 ATD clock
cycles and the discharge feature (SMP_DIS) enabled, which adds 2 ATD clock cycles.
1
2
3
4
5
6
7
8
Table A-15
D Reference potential
D Voltage difference V
D Voltage difference V
C Differential reference voltage
C ATD Clock Frequency (derived from bus clock via the
P ATD Clock Frequency in Stop mode (internal generated
D ADC conversion in stop, recovery time
D
V
SSA
prescaler)
temperature and voltage dependent clock, ICLK)
ATD Conversion Period
12 bit resolution:
10 bit resolution:
8 bit resolution:
ATD Characteristics
ATD Operating Characteristics
Factors Influencing Accuracy
Low
High
≤ V
and
RL
≤ V
Table A-16
Table A-4
IN
DDX
SSX
≤ V
3
unless otherwise noted, supply voltage 3.13V < V
to V
to V
Rating
RH
MC9S12XE-Family Reference Manual Rev. 1.23
Table A-15. ATD Operating Characteristics
show conditions under which the ATD operates.
SSA
DDA
1
≤ V
DDA
2
.
t
N
N
ATDSTPRC
N
V
Symbol
f
∆
∆
CONV12
CONV10
ATDCLk
RH
CONV8
V
V
VDDX
VSSX
RH
V
RL
-V
RL
V
–2.35
DDA
V
–0.1
3.13
0.25
DDA
Min
0.6
20
19
17
—
SSA
/2
< 5.5 V
Appendix A Electrical Characteristics
Typ
5.0
—
—
—
—
—
—
—
0
0
1
V
V
Max
DDA
0.1
0.1
5.5
8.3
1.7
1.5
42
41
39
DDA
/2
Cycles
clock
MHz
MHz
ATD
Unit
us
V
V
V
V
V
1221
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