MC9S12XEG128MAA Freescale Semiconductor, MC9S12XEG128MAA Datasheet - Page 42

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MC9S12XEG128MAA

Manufacturer Part Number
MC9S12XEG128MAA
Description
MCU 16BIT 128K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEG128MAA

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 12x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
80-QFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
59
Number Of Timers
25
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
No. Of I/o's
59
Eeprom Memory Size
2KB
Ram Memory Size
12KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
QFP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 1 Device Overview MC9S12XE-Family
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals. It is built from the signal description sections of the Block
User Guides of the individual IP blocks on the device.
1.2.1
The MC9S12XE-Family offers pin-compatible packaged devices to assist with system development and
accommodate expansion of the application.
The MC9S12XE-Family devices are offered in the following package options:
42
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
208-pin MAPBGA package with an external bus interface (address/data bus)
144-pin LQFP package with an external bus interface (address/data bus)
112-pin LQFP without external bus interface
80-pin QFP without external bus interface
Device Pinout
Smaller derivatives within the MC9S12XE-Family feature a subset of the
listed modules. Refer to
information about derivative device module subset and to
Availability by Package Option
details of pins available in different package options.
MC9S12XE-Family Reference Manual , Rev. 1.23
Appendix D Derivative Differences
and
NOTE
Table 1-9. Pin-Out Summary
Table 1-7. Port
for more
for
Freescale Semiconductor

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