UPD70F3735GC-GAD-AX Renesas Electronics America, UPD70F3735GC-GAD-AX Datasheet - Page 525

no-image

UPD70F3735GC-GAD-AX

Manufacturer Part Number
UPD70F3735GC-GAD-AX
Description
MCU 32BIT V850ES/JX3-L 80-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3735GC-GAD-AX

Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
66
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b, D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3735GC-GAD-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
V850ES/JF3-L
16.7 Output Pins
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
(1) SCKBn pin
(2) SOBn pin
When CSIBn operation is disabled (CBnCTL0.CBnPWR bit = 0), the SCKBn pin output status is as follows.
When CSIBn operation is disabled (CBnPWR bit = 0), the SOBn pin output status is as follows.
Remarks 1. The output level of the SCKBn pin changes if any of the CBnCTL1.CBnCKP and CBnCKS2 to
CBnCKP
0
1
2. n = 0 to 2
CBnCKS0 bits is rewritten.
Remarks 1. The SOBn pin output changes when any one of the
CBnTXE
CBnCKS2
0
1
1
1
2. ×: Don’t care
3. n = 0 to 2
CBnCTL0.CBnTXE, CBnCTL0.CBnDIR bits, and CBnCTL1.CBnDAP
bit is rewritten.
CBnDAP
Other than above
Other than above
×
0
1
CBnCKS1
CHAPTER 16 3-WIRE VARIABLE-LENGTH SERIAL I/O (CSIB)
1
1
CBnDIR
×
×
0
1
CBnCKS0
Fixed to low level
SOBn latch value (low level)
CBnTX0 value (MSB)
CBnTX0 value (LSB)
1
1
High impedance
Fixed to high level
High impedance
Fixed to low level
SOBn Pin Output
SCKBn Pin Output
Page 509 of 816

Related parts for UPD70F3735GC-GAD-AX